IC Reverse Engineering - Revision history

Juerd: /* Die removal */

2019-10-17T17:23:23Z

Die removal

← Older revision		Revision as of 17:23, 17 October 2019
Line 51:		Line 51:

	== Die removal ==		== Die removal ==
			[[File:Mamadiediedie.jpg\|thumb]]
	After decapping the die may still be attached to a metal base plate		After decapping the die may still be attached to a metal base plate
	or in the case of ceramic packages, the bottom of the package.		or in the case of ceramic packages, the bottom of the package.

Peterbjornx: /* Hydrogen fluoride / Buffered Oxide Etch */

2019-10-17T17:18:22Z

Hydrogen fluoride / Buffered Oxide Etch

← Older revision		Revision as of 17:18, 17 October 2019
Line 178:		Line 178:

	==== Hydrogen fluoride / Buffered Oxide Etch ====		==== Hydrogen fluoride / Buffered Oxide Etch ====
	~~These compounds contain~~ HF ~~acid which is incredibly poisonous and~~ we ~~currently~~		Due to the hazardous nature of these HF containing solutions we plan to first study alternative etchants
	~~lack the safety measures~~ to ~~handle them.~~

	==== Sodium hydroxide / Potassium hydroxide ====		==== Sodium hydroxide / Potassium hydroxide ====

Peterbjornx at 15:20, 17 October 2019

2019-10-17T15:20:23Z

Show changes

Peterbjornx: Created page with "{{Project |Name=IC Reverse Engineering |Picture=Thumbic.jpg |Status=In progress |Contact=User:peterbjornx |(Developing methods for) reverse enginieering ICs at..."

2019-10-17T14:12:35Z

Created page with "{{Project |Name=IC Reverse Engineering |Picture=Thumbic.jpg |Status=In progress |Contact=User:peterbjornx |(Developing methods for) reverse enginieering ICs at..."

New page

{{Project
|Name=IC Reverse Engineering
|Picture=Thumbic.jpg
|Status=In progress
|Contact=User:peterbjornx
|(Developing methods for) reverse enginieering ICs at the space
}}

== Introduction ==
Integrated circuits are a black box to most electronics hackers: the
datasheet tells you how to interface to them and if you stick to this
your project works. Sometimes, however, the chip does not behave as
you expected it to, or the vendor decides to withhold information from
you. In these cases you might want to take a look under the hood and
see what makes the IC tick.

This project is about developing the tools and methods to do so. Some
of these tools are taken from existing projects such as [[Decapping]].
Others are adapted from professional techniques, and others still are
made up on the go.

== Decapping ==

To start reverse engineering an IC, you first need to liberate the die
(the silicon "chip"). The methods for doing this depend on the type of
package.

=== Ceramic + sintered glass DIP packages ===

These are the packages used for EPROMs and 54-series glue logic. They
consist of two ceramic slabs with the lead frame cemented in between
them. You can easily open these with a pair of pliers by prying apart
the slabs.

=== Ceramic lidded packages ===

These are used for processors and can be either DIP or PGA. They will
either have one or two lids, and the lid is soldered in place using
high temperature solder. Desoldering can easily be done using a torch.

=== Organic lidded packages ===

Mostly used by Intel for Pentium II and onwards. Taking the lid off by
desoldering will not yield access to the die as the die void is filled
with epoxy resin. This can be removed by trimming off the edges of the
package and treating the die+epoxy part with [[#Colophony Decapping|molten colophony resin.]]